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Year 2008
Mono & Poly silicon 40MW cell production line - Turnkey solution offered
$ Call to discuss price
Guaranteed Average 18% efficiency on Mono
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Ref 7487 |
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Breakage Rate : <0.2%
Up Time : >95%
Full Automation Robot System
Hot Air Dry Type |
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Breakage Rate : <0.1%
Up Time : >98%
Long Flat Zone : 1465mm
Batch Capacity : 400wfs / 1Tube
Temp Control Accuracy : ±0.5 ℃ |
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Breakage Rate : <0.1%
Up Time : >97%
Environment Friendly : Not Use Wet Chemical
Small Foot-print : Smaller than Wet PSG Remover(1/6)
Low Cost of Operating(1/3) : No Chemical, DI, Wastewater |
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Breakage Rate : <0.2%
Up Time : >90%
Plasma Type : Direct Plasma.
Fast Heating with Lamp Heater +Plate Heater
Quick Wafer Cooling with Cooling Plate in Unload Chamber |
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Breakage Rate : <0.2%
Up Time : >93%
Max Cycling Time : 5.5sec / 2wfs
CCD Camera + Mechanical Align : Align Error “Zero”
Air Cushion type Wafer Table : Minimize Wafer Breakage |
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Breakage Rate : <0.2%
Up Time : >98%
Belt Speed : 3~15M/min
Temp Uniformity Over Total Wafer Area : <1.0 ℃
Belt Cleaning : Brush Cleaning (Option : Ultrasonic Cleaning) |
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One Rail Conveyor Belt
Fast Tact Time : 1.5 sec/wfs
Breakage Rate : <0.1%
Up Time : >98%
Wafer Edge Chipping Free
Vacuum Chucking Compatible to wafer warp of 2mm
Distance Control From Wafer Edge : 0.5mm ±0.1 |
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