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Year 2005 Rena InOx Etch Tool
$205,000
Located in USA
Operational until taken out of service in early 2010
Specifications:
Megawatt production: approximately 1700 wafers per hour 156mm x 156mm with a gap of 15mm and speed of 1M/min (up to 2010 wafers per hour 125 mm x 125mm)
Material Processed: Poly Silicon Wafers (Multi Crystalline Silicon) |
Ref 227384 |
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Process:
Side Etch Tool for PSG removal and junction isolation in a single tool. 5 transport lanes with working direction from left to right. Transport rollers transport wafers, down holder rollers hold the wafers to avoid buoying upwards.
Process chemical: Hydrofluoric Acid
Wafer Size processing capability: 125mm and/or 156mm Square
ATS automatic loading and unloading systems |
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Other info:
RENA Model InOx etch tool. Equipment is used after phosphoric doping for removal of excess PSG material and junction isolation to prepare wafers for silicon nitride coating in Roth & Rau SiNa lines. Machine is 14’L x 7’W x 7’H, input voltage 208V AC, 3ph, 60HZ, 15 amps. Installation, maintenance and operation manuals included with the purchase. ATS loader and unloader model # 1817 superbot autoload station with Allen-Bradley Panel View 600 controller. 10’ Long x 6’ Wide x 7’ High input voltage 208V AC, 3ph, 60HZ, 30 amps.Year 2006
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